Some chips use a lot more metal layers than others. A common rule of thumb is each metal layer increases wafer cost 10%. So, a chip with 5 more metal layers than another will cost 50%+ more. The most ...

Others would simply stack finished chips on top of each other, but the metal wires that connect the chip circuits to the rest of a computer system are always a big problem.

What are chip packaging and stacking? Traditionally, chip packaging was simply about protecting a single silicon die and connecting it to a circuit board.

Yesterday it was the "roof tile" method of stacking memory chips, and today IBM and 3M have announced that they are teaming up to develop a silicon glue that can be used to form "towers" out of ...

"By stacking chip components vertically, Broadcom's 3.5D platform enables chip designers to pair the right fabrication processes for each component while shrinking the interposer and package size ...