For over half a century, the semiconductor industry has been governed by a commonly known principle described as Moore’s Law. This “law” predicts that through technological advancement a doubling of ...

Serving the role of connecting a device and its tester, test sockets—also known as package probes—play a crucial interconnect role in integrated circuits (IC), and therefore the greater field of ...

All our computing devices rely on technology that allows them to connect to other devices and networks. Some of these work using electromagnetic systems, but a good number of them must use a physical ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...