For as long as semiconductor devices have been around, motor vehicles have been one of the toughest operating environments. Chips in automobiles, trucks, and buses are subject to extremes of ...

Heterogeneous integration and sophisticated packaging are making chips more difficult to test, necessitating more versatile and efficient testing methods to minimize the time and cost it takes for ...

Siemens today announced it has acquired ASTER Technologies (“ASTER”), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software. This strategic ...

SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced test ...

System-level test (SLT), once used largely as a stopgap measure to catch issues missed by automated test equipment (ATE), has evolved into a necessary test insertion for high-performance processors, ...

Guadalajara plan expands ASE’s global footprint, increases presence in North America The future establishment of a semiconductor packaging and test facility in Jalisco paves the way for the ...

Toshiba Corp. has produced the first functional test chip which conforms to a new integrated-circuit architecture called X, which includes interconnects using diagonal pathways as well as the ...