In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...

Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA) ...

LG Innotek recently unveiled the latest FC-BGA for the first time at the 'CES 2023'. LG Innotek's FC-BGA is highly integrated, multi layered and large scaled. Also, it has fine patterning and a lot of ...

The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...

LG Innotek has begun the mass production of flip chip ball grid array (FC-BGA), its new semiconductor substrate targeting tech firms in the United States. “We have begun mass production of FC-BGA for ...