Fig. 6: Backside power induces new heat flow patterns because the active devices are sandwiched between metal stacks. Source: Laura Peters/Semiconductor Engineering IBM developed an anisotropic model ...

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...

Ultimately, all the aforementioned elements are integrated on a single packaging substrate, followed by final testing. This results in a highly complex assembly flow, as illustrated in the figure ...