AI is driving demand and higher prices for DRAM and NAND into 2026.  Products using non-volatile memories to replace NOR and ...
In a new article by Business Korea and their industry sources, on June 23, SK hynix presented a research paper on the new 3D DRAM, aka "dream memory" at the semiconductor conference VLSI 2024, held in ...
Reports suggest ASUS is toying with the idea of making its own DRAM chip production line to serve the consumer market, but that is unlikely to happen.
Hitachi, Ltd. (NYSE: HIT / TSE: 6501) in cooperation with Elpida Memory, Inc. (TSE: 6665), have proposed a new DRAM(*1) circuit design enabling 0.4-V operation. The proposed array employs a twin cell ...
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
The continued dominance of the AI market is driving the DRAM memory industry into chip shortages, as the AI and HBM markets eat up all production capacity. In a new report from MyDrivers, the ...
The big picture: Persistent memory has long been anticipated to bring a paradigm shift in computing, but it's unlikely to happen anytime soon. In a recent webinar, industry insiders from the Storage ...
Why we need DDR5. Security improvements of DDR5 over DDR4. How RowHammer can be thwarted. Rapid growth in the world’s digital information has driven continued improvements in computing to process, ...
SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash (HBF) ...