With SRAM failing to scale in recent process nodes, the industry must assess its impact on all forms of computing. There are ...

A new technical paper titled “Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs” was published by researchers at Electronics and Telecommunications Research Institute ...

The world is experiencing an insatiable and rapidly growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications. Breakthroughs in machine learning, data analytics ...

The rapid expansion of artificial intelligence (AI) workloads is forcing a fundamental redesign of data center infrastructure, driving historic memory shortages and opening a rare market window for ...

TL;DR: AMD's Instinct MI350 series AI accelerators, built on TSMC's advanced N3P process, deliver enhanced AI performance with 185 billion transistors, up to 288GB HBM3E memory, and superior power ...

I attended the IEEE Hot Chips Conference at Stanford and I wanted to share some of the interesting developments related to digital storage and memory technologies and other interesting developments.

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even ...

What is physical AI? What is included in Cadence’s Physical AI Chiplet Platform? What is the Chiplet Spec-to-Packaged Parts ecosystem? Physical AI takes advantage of the improvements in artificial ...

TAIPEI, Dec. 1, 2025 /PRNewswire/ -- The rapid expansion of artificial intelligence (AI) workloads is forcing a fundamental redesign of data center infrastructure, driving historic memory shortages ...