・Intel claims that its 18A process offers up to 15% better performance per watt and 30% better chip density. ・Nvidia’s hesitation came despite a $5 billion investment it made in Intel earlier this ...

TSMC has quietly revealed that it had commenced volume production of chips using its N2 (2nm-class) fabrication process. The company did not issue a formal press release notifying about the production ...

TSMC has rolled out its new A14 node, marking its first foray into the 1.4 nm-class manufacturing tech, and it’s already boasting serious gains in performance, power efficiency, and logic density.

Taiwan Semiconductor Manufacturing Company TSM is advancing its nanosheet chip technology roadmap with N2, N2P, A16, and A14 with the aim of improving performance and efficiency at advanced nodes. The ...

New vertical device architecture promises stable, ultra-dense semiconductor stacking for future AI and high-performance ...

Lead-acid batteries play a key role in energy storage systems due to their high energy density, low cost, and excellent reliability. However, overcharging and over-discharging can significantly ...

Able to perform in circuits operating at frequencies as high as 1 MHz, the PIP212-12M chip-scale power module claims on-board space savings of up to 50%, conversion efficiencies as high as 94%, and up ...

So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.