At Cadence, Bansal noted that the company has been building up its 2.5D/3D flow most notably with STMicroelectronics; in addition to its inclusion in foundry reference flows. Mentor, as well, has ...

Amid the COVID-19 crisis, the global 3D IC and 2.5D IC Packaging Market estimated at USD 86.8 Billion in the year 2020, is projected to reach a revised size ...

Featuring both 3D and 2.5D graphics rendering capabilities, GCNano3DVG delivers an optimal balance between visual performance and power efficiency, making it ideal for a wide range of applications ...

Nextech AR is Seeing A Dramatic Increase In 3D Model Demand in Q4 2022 and FY 2023 October 12, 2022 07:30 AM Eastern Daylight Time ...

Nextech3D.AI, an AI-3D model supplier for major e-commerce retailers announces its new breakthrough AI Powered 3 D model search engine has increased the Company's 3 D modeling productivity by up ...

Advantages and Drawbacks of Each Packaging Type in Both 2.5D and 3D Configurations 2.5D Si: There are two alternatives within this category: Si interposer, utilizing a full passive Si wafer, and Si ...