New FormNow Integration Connects AI-Generated 3D Models Directly to Professional Print Fulfillment BOSTON, April 14, 2026 /PRNewswire/ -- Meshy.ai, the world's leading generative AI 3D platform, today ...
A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, ...
Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...
Peek inside the package of AMD’s or Nvidia’s most advanced AI products and you’ll find a familiar arrangement: The GPU is flanked on two sides by high-bandwidth memory (HBM), the most advanced memory ...
3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...
Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling ...
Power delivery now spans stacked dies, interposers, bridges, and packages connected by thousands of micro-bumps and TSVs.
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...
Successive versions of vertical transistors are emerging as the likely successor to finFETs, combining lower leakage with significant area reduction. A stacked nanosheet transistor, introduced at N3, ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
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